- The shortest part times thanks to the efficient combination of highspeed plasma cutting with high machine dynamics.
- 15 – 40 % shorter cutting times with the help of the 3.75-inch cutting head optimized for thin-sheet applications.
- Minimal operating costs due to power-saving and abrasion-free semiconductor power supply and magnet-mounted compressors.
- Great process stability thanks to the latest Bystronic technologies.
